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PI Varnish&Powder/Mold

PI Advanced Materials enable the possibility of Polyimide with creative innovation.​
It connects people, society, and the world.​

Business Introduction​

Powered by PI Advanced Materials’ best-in-class R&D and manufacturing capabilities, our PI varnish and powder/mold materials offer tailored solutions to a diverse range of industries and customers​

Dedicated production facility for PI varnish 
Advanced process technology and 
quality control 
Proprietary PI varnish
R&D and  production technology
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Accerlerated 
time-to-market 
based on
anticipation of
customers’ needs
Stable supply of high performance PI varnish with excellent heat resistance,  insulation and adhesion properties ​
Customized solutions for
a diverse  range of
customers’ needs 
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Total Solution Provider

of PI varnish, power/mold materials

Mobility Business
(Electric Vehicle)

PI varnish for insulation of electric motors in electric vehicles. Our PI varnish has been adopted for use in the world’s first pure EV-exclusive platform. ​

Semiconductor
Business

Highly thermal-resistant, insulative and adhesive PI varnish for major semiconductor
customers in the world ​

New Businesses
(Powder, Display, Tube, etc.)

A diversified product portfolio of new materials 
addressing the emerging demand for
next generation applications​

EV (Electric Vehicle)

Electric motor lightweighting is crucial for increasing EV power output and enabling high-speed charging. PI Advanced Materials’ PI varnish not only reduces vehicle weight significantly, but also improves thermal stability and provides electrical insulation for reliable performance.  Our PI varnish has been adopted for use in the world’s first pure EV-exclusive platform. ​

Semiconductor

PI Advanced Materials’ semiconductor varnish is an essential material for its electrical insulation and adhesive properties during semiconductor manufacturing process. We are supplying customized varnish to major semiconductor manufacturers in the world, and are developing Photosensitive Polyimide (“PSPI”) for our semiconductor customers.

Powder/Mold

The demand for advanced engineering materials that can provide continuous operation at cryogenic to high temperatures and withstand high friction is increasing due to advances in thermal process technology. PI Advanced Materials’ PI powder and mold products address the rising market demand for thermal and wear resistance from our customers in a variety of industries.

Display

The paradigm in flexible OLED panels is shifting to thinner and even more flexible panels. PI varnish for flexible OLED printed circuits with heat resistance, dimensional stability and flexibility is a solution that can potentially replace glass in the future.  PI Advanced Materials is developing differentiated products from the competition with either colorless, eco-friendly or low dielectric properties to become the first mover in the next generation display applications.

Tube​

PI varnish for printer tubing is highly heat resistant for reliable performance, and its applications are expanding from home and office printers to the next generation 3D printers. 

Product Introduction​

Leomid™ (PI Varnish)

Our PI varnish provides optimal solutions for semiconductors, displays, electric vehicles and rechargeable batteries that can help transform industries and our everyday lives.

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Pl Varnish Features

  • Thermal properties
    Thermal Properties

    With the decomposition temperature of 560℃ or higher, Leomid™ PI varnish’s non-melting properties can preserve dimensional stability during heat treatment process at extreme temperatures.

  • Electrical and mechanical feature
    Electrical and Mechanical Properties

    Leomid™ PI varnish maintains its excellent electrical insulation, tensile strength and abrasion resistance even in the harshest of conditions.

  • Long-term storage property
    Superior long-term storage stability

    Leomid™ PI varnish maintains stable viscosity at room temperature, and can be used over the long-term if kept in refrigerated storage.

  • Custom design
    Customization

    Leomid™’s properties including solids content, viscosity and solvent type can be tailored to meet customers’ technical requirements for targeted applications.

PI Varnish for Enamel

Leomid VE
PoIyimide Varnish for Enamel
Features
  • Excellent heat stability and flexibility
  • Excellent adhesion to metal wire
  • Excellent corona discharge resistant​
Application
  • Wire/Rod for EV, Pump, Electrical Equipment, etc.​
PoIyimide Varnish for Enamel
PoIyimide Varnish for Semiconductor

PI Varnish for Semiconductor
(Non-photosensitive, Photosensitive)

Leomid VS
PoIyimide Varnish for Semiconductor
Features
  • Superior Thermal & Flexibility​​
  • Good Dielectric & Chemical Resistance
  • Excellent Adhesion
Application
  • Passivation or Sacrificial layer​
    (Transistor, PN Junction, Diode, Infrared Sensor, IC Chip, etc.)​

PI Varnish for Display

Leomid VD
PI Varnish for Display
Features
  • Dimensional Stability​
  • Superior Thermal & Flexibility​
  • Excellent Storage Stability
Application
  • TFT Substrate for Flexible OLED Display​
PI Varnish for Display

Product Introduction

Leomid MP™​

Built on proprietary technology, PI Advanced Materials’ Leomid MP™ has a broad range of applications from machinery and display to semiconductors and aerospace industries. Leomid MP™ is a new solution for industrial applications requiring reliable performance under the most severe operating conditions.  ​

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PI Powder/Mold Features

  • 열적특성
    Thermal Properties

    Leomid MP™ can maintain its original properties even at 300℃ and dimensional stability upto 500℃.

  • 내마모성
    Abrasion Resistance

    Self-lubricating and highly heat resistant, Leomid MP™ can retain its original shape and size against high friction and abrasion.

  • 가공성
    Processability

    Leomid MP™’s excellent elasticity allows high-precision processing of small tolerance components.

  • 치수 안정성
    Dimensional Stability

    Leomid MP™’s ability to retain its original dimensions under high-pressure and temperatures makes it ideal for component integration applications.

PI Powder for Filler

Powder
Features
  • Superior Thermal & Dimensional Stability​​
  • Excellent Property for Filler
Application
  • TCompound Filler, Diamond Wheel, Fiber, etc.​
Powder
Direct Forming Mold​

PI DF for Mass-Production

Direct Forming Mold​
Features
  • Compression molding for each application with shape​
  • Mainly applied to mass-produced items
Application
  • Thrust Plug/Plate, Blank, Brake Pad, Tube, etc.​

PI CM for Semi-Product

Compressing Mold​
Features
  • Semi-finished products such as Sheet​
  • Mainly Used for machining customized products​
Application
  • Roller, Guide Pin, Vacuum Pad, etc.​
Compressing Mold​

Product inquiry

If you wish to make an inquiry regarding a product, please contact our representatives below.

PI Varnish&Powder/Mold Division

sales@pimaterials.com
+82-2-2181-8600