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PI Film

PI Advanced Materials enable the possibility of Polyimide with creative innovation.​
It connects people, society, and the world.​

Business Introduction

As the global leader in Polyimide film, we are pioneering groundbreaking technology for the future. ​

World's largest Polyimide 
film production
capacity​
Advanced process
technology 
and quality control ​
Seizing new growth  opportunities with innovation
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A wide array of products fulfilling
a broad range of needs 
Stable supply of
high quality
​ products
Getting ahead of
demand with  new product development ​
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Optimal Solution Provider ​

​for an extensive range of market demands
and customer needs ​

Flexible Printed Circuit Board (FPCB)​

Driven by higher processing requirements, the growing number of functionalities and the trend for thinner design, FPCB has been replacing RPCB (Rigid Printed Circuit Board) rapidly due to its thin and flexible features. PI Advanced Materials’ Polyimide film for FCCL (Flexible Copper Clad Laminate), coverlay and substrate in FPCB lays the foundation for flexible and compact integrated circuits in smart devices to enable high performance in a compact design. 

Graphite Sheet

Having thermal conductivity two times higher than that of natural graphite sheet, three to seven times higher than that of aluminium, and two to four times higher than that of copper, synthetic graphite sheet is a popular and widely adopted thermal management solution for smart devices.  PI Advanced Materials’ Polyimide film is an essential base material for synthetic graphite sheet that stops excessive heating of internal components in smart devices.  

Rechargeable Battery Insulation ​

Protecting rechargeable batteries for electric vehicles requires a highly heat-resistant material that also provides cell-to-cell insulation for safety and reliable performance.  PI Advanced Materials’ Polyimide film meets the most strigent industry standards for safety of the rechargeble batteries used in EVs.

High-speed Communication

Reducing transmission loss is imperative to maintaining the high data transfer speed of 5G, and is even more so for mission-critical control applications such as autonomous vehicles and artificial intelligence. PI Advanced Materials’ Modified Polyimide Film (“MPI”) has a low dielectric constant suitable for 5G antenna, which can support latency-free data communication by minimizing transmission loss.​

Display

The increasing penetration of 4K/8K resolution and OLED panels mean more Chip on Film (“CoF”) interconnection is needed per unit to support high-resolution display. PI Advanced Materials is the first and only company in Korea that succesfully commercialized Polyimide film for CoF application.  We also supply the majority of FPCB protection film for foldable devices, and are developing Polyimide film that can replace the display cover glass. From CoF and foldables to cover glass, PI Advanced Materials is at the forefront of the latest flexible display revolution.  

Products Introduction

PI Advanced Materials PI Film

We are the leading provider of PI films for a wide range of applications. Our products are essential for the manufacturing of FPCBs, thermal protection graphite sheets and other crucial components for electric vehicles, semiconductors and flexible displays. Our innovation through research and development enables us to address demands for new future applications.

PI Film 이미지
PI첨단소재 PI Film 이미지

PI Film Features

  • Thermal properties
    Thermal Properties

    Able to withstand extreme temperatures ranging from absolute zero to 400°C,
    Our PI film solutions can help downstream customers advance their manufacturing process under any environmental temperatures.

  • Dimensional stabilit
    Dimensional Stability

    PI film retains its original shape and form over a wide temperature range for durability and reliability of the end products.

  • Electrical characteristic
    Electrical Properties

    PI film is a corona discharge resistant, electrical insulating material that can be used in high voltage environments for stablity of electronic devices.

  • Flexibility
    Flexibility

    Due to its excellent bendability and dimensional stability, PI film is suitable for flexible/foldable applications, and affords flexibility in PCB design.

Diversified Applications

PI Advanced Materials offers a full range of PI film for smart devices, electric vehicles, semicondutors, displays, aerospace and industrial generators.

PI Film for IT & Industry

Polyimide Film for FCCL and FPCs
Features
  • Excellent Mechanical, Electrical Properties and Dimensional Stability
  • CTE Matched with Copper Foil
Application
  • TFT Substrates for Flexible Display (Yellow PI)
  • Insulating, Coating, Protecting & Matrix Materials
Polyimide Film for FCCL and FPCs
Polyimide Film for High Temperature Insulation
Features
  • Superior Elongation and Lower Stiffener / Spring Back
  • Excellent Thermal and Insulation Properties
Application
  • Coverlay, Stiffener for FPCB
  • High Temperature Tape & Label, etc.
Polyimide Film for High Temperature Insulation
Polyimide Film for Graphite Sheet
Features
  • Materials for Superior Thermal Conductivity
  • Cosmetic Improvement on Graphite Sheet Surface
  • Minimize Loss from Shrinkage during Carbonization Process
  • Various Thickness
Application
  • Synthetic Graphite Sheet
Polyimide Film for Graphite Sheet
Polyimide Film for Graphite Sheet
Features
  • Materials for Superior Thermal Conductivity
  • Cosmetic Improvement on Graphite Sheet Surface
  • Minimize Loss from Shrinkage during Carbonization Process
  • High Thickness Graphite
Application
  • High thickness synthetic Graphite Sheet
Polyimide Film for Graphite Sheet
Black Polyimide Film

Black Polyimide Film

GD-A
Black Polyimide Film
Features
  • Excellent Optical Properties: Low Gloss, Light Shielding
  • Excellent Mechanical, Electrical Properties and Dimensional Stability
  • CTE Matched with Copper Foil
  • Uniform Thickness
Application
  • Coverlay, Stiffener for FPCB
  • Electronic Optical Components
  • Insulation Tape, Label, etc.

Low CTE Polyimide Film

GL-A
Low CTE Polyimide Film
Features
  • Superior Dimensional Stability & Thermal Properties
  • High Modulus & MD-TD Balanced Low CTE
  • Superior Peel Strenth
  • Defect-Free Surface
  • Smooth Surface Roughness
Application
  • COF (Chip on Film)
  • Stiffener
  • Substrate for Flexible Solar Panel, etc.
Black Polyimide Film
Low Df Polyimide Film

Low Df Polyimide Film

FG
Low Df Polyimide Film for High Frequency FPCB
Features
  • Low Dissipation Factor to Minimize Signal Transmission Loss in Flexible Printed Circuit Board
  • Reliable Adhesion with Most Adhesives
  • Excellent Mechanical and Bending Properties
Application
  • FCCL, Coverlay, Stiffener, etc. for High Frequency FPCB

Product inquiry

If you wish to make an inquiry regarding a product, please contact us by email below.  A representative will respond to your inquiry promptly. 

PI Film Division​

pif@pimaterials.com
+82-2-2181-8632