Applications
PI Advanced Materials delivers transformative Polyimide innovation
that connects people, societies and the world.
IT
PI film and varnish are the essential base materials providing critical functions such as substrate, thermal protection, and electrical insulation for IT modules and components including FPCBs, graphite sheets, and batteries, all of which are widely used in an array of smart devices such as smartphones and tablets.
PI film is the base material used for manufacturing FPCB components such as 3-layer FCCL, 2-layer FCCL, and coverlay, and stiffener, and provides substrate, protection, and reinforcement to FPCB used in electronic devices. Due to the market demand for high-performing and compact electronic devices, adoption of FPCB that offers more circuit design flexibility is increasing.
*FCCL : Flexible Copper Clad Laminate
Synthetic graphite sheet made by carbonizing PI film is used for heat dissipation in smart devices. Graphite sheet is one of the most thermally conductive materials among those commercially available, and is lightweight and thin. Synthetic graphite sheet’s thermal conductivity is 2~4 times higher than copper, 3~7 times higher than aluminum, and 2 times higher than natural graphite sheet. Graphite sheet is one of the most commonly adopted thermal management solutions for smart devices.