PI Advanced Materials enable the possibility of Polyimide with creative innovation.
It connects people, society,
and the world.
As the global leader in Polyimide film, we are pioneering groundbreaking technology for the future.
Optimal Solution Provider
for an extensive range of market demands
and customer needs
Flexible Printed Circuit Board (FPCB)
Driven by higher processing requirements, the growing number of functionalities and the trend for thinner design, FPCB has been replacing RPCB (Rigid Printed Circuit Board) rapidly due to its thin and flexible features. PI Advanced Materials’ Zenimid™ Polyimide film for FCCL (Flexible Copper Clad Laminate), coverlay and substrate in FPCB lays the foundation for flexible and compact integrated circuits in smart devices to enable high performance in a compact design.
Graphite Sheet
Having thermal conductivity two times higher than that of natural graphite sheet, three to seven times higher than that of aluminium, and two to four times higher than that of copper, synthetic graphite sheet is a popular and widely adopted thermal management solution for smart devices. PI Advanced Materials’ Zenimid™ Polyimide film is an essential base material for synthetic graphite sheet that stops excessive heating of internal components in smart devices.
Rechargeable Battery Insulation
Protecting rechargeable batteries for electric vehicles requires a highly heat-resistant material that also provides cell-to-cell insulation for safety and reliable performance. PI Advanced Materials’ Zenimid™ Polyimide film meets the most strigent industry standards for safety of the rechargeble batteries used in EVs.
High-speed Communication
Reducing transmission loss is imperative to maintaining the high data transfer speed of 5G, and is even more so for mission-critical control applications such as autonomous vehicles and artificial intelligence. PI Advanced Materials’ Modified Polyimide Film (“MPI”) has a low dielectric constant suitable for 5G antenna, which can support latency-free data communication by minimizing transmission loss.
Display
The increasing penetration of 4K/8K resolution and OLED panels mean more Chip on Film (“CoF”) interconnection is needed per unit to support high-resolution display. PI Advanced Materials is the first and only company in Korea that succesfully commercialized Polyimide film for CoF application. We also supply the majority of FPCB protection film for foldable devices, and are developing Polyimide film that can replace the display cover glass. From CoF and foldables to cover glass, PI Advanced Materials is at the forefront of the latest flexible display revolution.
We are the leading provider of PI films for a wide range of applications. Our products are essential for the manufacturing of FPCBs, thermal protection graphite sheets and other crucial components for electric vehicles, semiconductors and flexible displays. Our innovation through research and development enables us to address demands for new future applications.
Able to withstand extreme temperatures ranging from absolute zero to 400°C,
Our PI film solutions can help downstream customers advance their manufacturing process under any environmental temperatures.
PI film retains its original shape and form over a wide temperature range for durability and reliability of the end products.
PI film is a corona discharge resistant, electrical insulating material that can be used in high voltage environments for stablity of electronic devices.
Due to its excellent bendability and dimensional stability, PI film is suitable for flexible/foldable applications, and affords flexibility in PCB design.
PI Advanced Materials offers a full range of PI film for smart devices, electric vehicles, semicondutors, displays, aerospace and industrial generators.
If you wish to make an inquiry regarding a product, please contact us by email below. A representative will respond to your inquiry promptly.